Vertiv CoolLoop Trim Cooler

Vertiv has introduced the Vertiv CoolLoop Trim Cooler, in support of air and liquid cooling applications for AI and HPC (high-performance computing). This cooler supports diverse climate conditions for hybrid-cooled or liquid-cooled data centres and AI factories.

Integrating with high-density, liquid-cooled environments, the AI-ready cooler provides operational efficiency and aligns with the industry’s evolving needs for energy-efficient and compact cooling solutions. It provides up to a 70% reduction in annual cooling energy consumption leveraging free-cooling and mechanical operation, and 40% space savings compared to traditional systems. Designed to address the challenges of modern AI factories, the system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C.

Straightforward water connections are said to provide smooth and direct system integration for the Vertiv CoolLoop Trim Cooler and the Vertiv CoolChip CDU coolant distribution units, for direct-to-chip cooling. The cooler can also connect directly to immersion cooling systems. This simplifies installation and operational complexity, allowing compatibility across a range of high-density cooling environments, providing time savings and cost efficiencies for customers.

The cooler uses low-GWP refrigerant and provides a scalable cooling capacity up to almost 3 MW in the air-cooled configuration. With free cooling coils optimised for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions, for reduced electrical consumption and CO₂ emissions.

It is compliant with 2027 EU F-GAS regulations ban, avoiding the need for redesigns or infrastructure upgrades to meet the regulatory requirement.